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Toward Mitigating Process-Induced Performance Degradation in 3.5D Heterogeneous Packages via Pre-Silicon Firmware Co-...
This paper presents a pre-silicon analysis of XRM-SSD V24/V7.0, a physics-aware predictive firmware scheduling layer for Intel's 3.5D heterogeneous integrated packages (Foveros Direct 3D + PowerVia + EMIB-T + UCIe + HBM5). Using detailed thermal-electrical co...
Score 75
Source Type arxiv
Reposts 0
Topic Quality 64
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